Product Overview
By integrating fast heating with pressure control technology, this device achieves ultra-fast heating within 0 to 10 seconds, producing ultra-fast thermal shock effects. It enables the observation of changes in the material's structure and properties under conditions of extreme temperature variations and intense thermal shock, enabling the ultra-fast synthesis of small molecule nanomaterials
Advantages
Ultra-fast sintering speed (seconds);
Sintering time (minutes)
Strong bonding force, ensuring more secure powder bonding
Intelligent temperature range selection (100-3000℃ segmented measurement)
Can test 2-4 samples at once
Sintering Methods: Contact, Thermal Radiation, Sandwich
Application Scenarios
Carbon materials
Ceramic materials
Battery electrodes, solid-state electrolytes, catalytic materials
Two-dimensional materials, high-entropy materials, MOFs, 3D printing materials
Metals and composite materials, etc.
Sample State
Films
Powders
Bulk materials
Battery materials
Catalysts
Graphene and nanomaterials
Ceramic materials
High-entropy alloys and compounds
Temperature Range: | 100-3000℃ |
Power: | 1800W |
Electrical Specifications: | 220V, 18KW (customizable) |
Overall Dimensions: | 100×60×60 cm |
Sample Diameter: | 40mm/30mm/20mm/10mm |
Sample Thickness: | Up to 10mm |
Temperature Range: | Sample Platform: Up to 3000℃ |
Vacuum level: | 6×10^-2 Pa |
Chamber Operating Mode: | Vacuum, Ambient Inert Gas/Nitrogen Cycle (optional)/Ammonia Cycle (optional) Protection |
High-Temperature Sintering Platform: | Copper, Quartz Tube |
Temperature Probe: | Infrared Non-Contact, Accuracy ±1% Full Scale |
Electrode Material: | Copper |
Operating Method: | Touchscreen Operation |
Gas Line Specifications: | 1 Inlet, 1 Exhaust, 1 Vacuum |
Pulse Parameters: | 100 pulses/ms |
Heating Rate: | Over 20000℃/s |